By Ed Korczynski On Jul. 20, 2011
If we accept that many of the 300mm process tools are already effectively dedicated to either memory or logic lines, will this trend continue to 450mm such that the market will be three different types of 450mm fabs: Intel, foundries, and memory. If so, then beyond physical wafer standards, how could we get to tool standards? As Paul mentioned in another post, increased standardization in robotics Read More>>
By MCA Admin On Jul. 15, 2011
As Gus Richard quipped, Intel, TSMC, and Samsung (ITS) can certainly afford 450mm, but who else might among memory manufacturers? Read More>>
By Ed Korczynski On Jul. 12, 2011
Will fabs still insist upon dual-sourcing strategies for OEM tools...will they be willing and able to support two sources for each key tool? Read More>>
By Ed Korczynski On Jul. 12, 2011
Neither too early nor too late will work. Read More>>