What's going on in the NON-TSV 3D world? (concluded)

Is your company embracing 3D packaging solutions that don't involve TSVs? This is your discussion. We'll be looking at 3D solutions that embrace the existing infrastructure, or require little adaptation to bring to market.

By Francoise von Trapp on Jul. 16, 2010

Site: 3D InCites (Public)

Forum: SEMICON West 2010 3D Wrap-up Forum - # of views: 1765

Conclusion Summary:

Francoise von Trapp

August 2, 2010 - 10:22am

Due to lack of participation, this discussion thread is being closed. We will readdress the topic at a later date.

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Francoise von Trapp

July 19, 2010 - 2:03am

In the 3D packaging realm, there are a number of alternative approaches to 3D stacking other than using TSVs. Are these merely interim approaches while TSV kinks are worked out, or do you think there will continue to be developments to improve existing technologies along side emerging ones?

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What's going on in the NON-TSV 3D world? (concluded)

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