DATE 3D Workshop 2010 Preview Discussion (concluded)

By Francoise von Trapp on Feb. 03, 2010 Site: 3D Design, Test and Inspection (Public) Forum: Design Forum - # of views: 2563

 

Thank you for all who participated in this week's discussion about the upcoming 3D events being featured as part of DATE 2010.  In addition to the workshop, Erik Jann Marinissen pointed to some other 3D related events happening that week.

What is unique about this particular event, as Erik so eloquently points out, is that a true spirit of collaboration across the supply chain is vital to bringing 3D integration to market. To this end, this year's event addresses an even broaders scope of participants, with a "balanced mix" of presentations.

Best of luck to you all this year. I can't wait to hear how it all went. 

 

Good Morning, Erik, Geert and Yann, thank you for joining us in discussion this week on 3D InCites.I look forward to this week's discussion on the upcoming 3D Workshop at DATE 2010.

The Design and Test Europe (DATE) conference addressed 3D integration for the first time in 2009 in the 3D Workshop.  Speakers at that event painted a promising picture for the future of 3D TSV technologies, noting that while design and test solutions were necessary, they would not be "a show stopper".  There was a call for pathfinding, tech-tuning and design authoring tools. How have last year's calls to action affected the advancement of 3D TSVs over the course of the year?  

 

The first edition of the "3D Integration" workshop (co-located with DATE'09 in Nice, France) did not so much define a joint "call to action", but brought together experts and novices in "3D" to share results and experiences, and learn from each other. Most other 3D events are rooted either in the process technology or packaging communities. While DATE has an emphasis on design and design automation, with the "3D Integration" workshop we try to bring together practising engineers and researchers from applications, architecture, design, automation, test, process technology, and equipment. It requires expertise from these diverse domains to make TSV-based stacked ICs to become product reality. Hence, the word "Integration" in the workshop's name not only refers to the technical process of integrating, but also to the integration of people and their knowledge. I think this was actually nicely summed up in the title of last year's panel session: "The Future of 3D Integration From All Angles"...

 Last year's workshop was such a success (both in content as well as in participant numbers) that we decided to run it again this year. DATE'10 takes place in Dresden, Germany, so that is where we will be on March 12. Again, we have the wide-scope view. In fact, we have expanded the scope deliberately, for example with an invited keynote address from an OSAT, Amkor in this case.

 Erik Jan Marinissen
Workshop's General Chair

 

 

O yeah, I forgot to mention: If you are interested to attend the workshop, discounted early registration rates are available till the end of this week, Friday February 12. Registration is available through the DATE conference (you can register for the workshop only, or combine it with the conference registration) and works either on-line (http://www.date-conference.com) or through a fax-back form (attached).

 

Regarding #2

Erik - You're point about event focus is well taken. I think it's becoming apparent that in order to adopt 3D integration technologies, there needs to be a shift across the supply chain in how things are done, and the best way to do that is to involve everyone in the process.  At this year's RTI 3D event, I was talking to Claudio Truzzi, of Alchimer, who I believe is one of the presenters at this year's DATE 2010, and he noted that merely adapting technologies and processes developed for 2D methodologies isn't an effective way to approach 3D integration. He used the analogy of an artist who works in both paint and sculpture - and that you wouldn't use the same tools to paint a  landscape as you would to cast a statue. Would you agree?

 

Panelists and Participants: Note that there's a concurrent discussion taking place in this Design Forum addresssing some similar topics: TSV - Is it a wire or a device? Some related discussion is occuring that you might find interesting and want to comment on.

 

Regarding #4

That is probably indeed what is so challenging about this 3D Integration topic: it requires expertise and changes from very many disciplines, and hence "everyone" (well, not literally everyone, not my granny, but definitely many in our field) needs to be involved.

 When putting the workshop program together, the Program Committee tried to make a balanced mix from the various strong submissions we got. Applications are covered in a presentation on a 3D CMOS imager by UCSB (US) and ITRI (Taiwan). Architecture-level design is discussed in a talk by universities from Cyprus and Greece. Design (and to some extend also test) is the topic of an invited keynote by dr. Cheng-Wen Wu, director of ICL at ITRI, Taiwan. Test, and more specific, open TSV defects, are the main subject of a paper from Hong-Kong. EDA, in this case thermal TSVs, is covered by folks from Synopsys. Technology and equipment is discussed by presentations from resp. Alchimer (France) and Suss MicroTec (US). And packaging, assembly, and test is the topic of our second invited keynote, by Jacky Seiller of Amkor Technology. And these are just the oral presentations. In addition, we have about 20 posters on a variety of 3D-related topics, and of course our panel session at the end of the day. The full program is available at http://www.date-conference.com/conference/date10-workshop-W5. It feels really exciting that the workshop will be taking place in just a month from now!

 

I think it is worthwhile to mention that in the same DATE'10 week in Dresden, Germany, not only the "3D Integration" workshop takes place. There are also several other events on 3D integration. Here is a list with events as I know them; feel free to add in case I forgot something.

Monday March 8, 09:30-18:00h
DATE Full-Day Tutorial
‘Chip-Package Co-Design Challenges for 3D Integration’
Organizers: Herb Reiter – eda2asic, USA; Pol Marchal – IMEC, BE
Speakers : Jochen Reisinger, Geert Van der Plas, Ravi Varadarajan, Ghislain Kaiser, Edmund Cheng, Dragomir Milojvic, Peter Schneider, Terry Ma, Vassilious Gerousis, Yann Guillou, Jean-Christophe Eloy
Registration: via DATE (requires separate registration fee)
Location: Int. Conference Center, Dresden

Thursday March 11, 16:00-17:30h
DATE’10 Conference Hot-Topic Session 12.2
‘3D Stacked ICs: Technology, Design, and Test’
Organizers: Patrick Girard – LIRMM, FR; Erik Jan Marinissen – IMEC, BE
Speakers : Armin Klumpp – Fraunhofer IZM, DE; Paul Franzon – North Carolina State University, US; Erik Jan Marinissen – IMEC, BE
Registration: via DATE (requires conference registration)
Location: Int. Conference Center, DresdenThursday March 11, 18:00-21:00h
Global Semiconductor Alliance

– EDA Interest Group Meeting
‘3D/TSV Technology’
Organizer: Herb Reiter – eda2asic, USA
Speaker : Executive from ST-Ericsson
Registration: free, e-mail to herb@eda2asic.com
Location: Café Friedrichstraße 38/40, Dresden (900m from DATE)
Free participation; complimentary cocktails; dinner afterwards at own expenses

Friday March 12, 08:30-16:00h
DATE'10 Friday Workshop W5 on
‘3D Integration’
Organizers: Erik Jan Marinissen - IMEC, BE; Yann Guillou - ST-Ericsson, FR; Geert Van der Plas - IMEC, BE
Program: see http://www.date-conference.com/conference/date10-workshop-W5
Registration: via DATE (requires separate registration fee)
Location: Int. Conference Center, Dresden

 

Erik -

Thanks for adding this information. I was not aware of it. Also, As I will not be in Dresden for this event, I would welcome a guest blog post contribution from you, Yann or Geert - whoever has the time!

 

 

Hi Francoise,

This conference in Dresden will definitively be an exciting week with so many events on 3D. As previously stated by Erik, it is very interesting to have a conference on 3D not only focusing on TSV process or packaging but having a strong design, test, architecture and application flavors.

Yann