BrightSpots Sit Down with Jean-Christophe Eloy, Yole Developpement

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Francoise von Trapp, editorial director of 3D InCites and BrightSpots 3D IC Forum moderator, sits down for a one-on-one Q&A session with each of the BrightSpots 3D IC Forum panelists.

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Karen Do on July 28, 2009 - 5:55pm

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BrightSpots Sit Down with Jean-Christophe Eloy, Yole Developpement

By Karen Do on Jul 28, 2009

BrightSpots Sit Down with Robert Patti, Tezzaron Semiconductor

By Karen Do on Jul 28, 2009

BrightSpots Sit Down with Ricardo Borges, Synopsys

By Karen Do on Jul 28, 2009

BrightSpots Sit Down with Sitaram Arkalgud, SEMATECH

By Karen Do on Jul 28, 2009

BrightSpots Sit Down with Paul Lindner, EV Group

By Karen Do on Jul 28, 2009

Part 1: Defining 3D at the Packaging Level and the Circuit Level

By Karen Do on Jul 20, 2009

Part 2: Wire Bonding vs. TSVs and Design Tools for 3D

By Karen Do on Jul 20, 2009

Part 3: Thin-wafer Handling Temporary Bonding/Debonding

By Karen Do on Jul 20, 2009

Part 4: 3D vs. Traditional Scaling

By Karen Do on Jul 20, 2009

Part 5: Heat Generation Issues with Chip Stacking and Thermal Dissipation Requirements

By Karen Do on Jul 20, 2009

BrightSpots Sit Down with Jean-Christophe Eloy, Yole Developpement

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All Audio/Videos

BrightSpots Sit Down with Jean-Christophe Eloy, Yole Developpement

BrightSpots Sit Down with Robert Patti, Tezzaron Semiconductor

BrightSpots Sit Down with Ricardo Borges, Synopsys

BrightSpots Sit Down with Sitaram Arkalgud, SEMATECH

BrightSpots Sit Down with Paul Lindner, EV Group

Part 1: Defining 3D at the Packaging Level and the Circuit Level

Part 2: Wire Bonding vs. TSVs and Design Tools for 3D

Part 3: Thin-wafer Handling Temporary Bonding/Debonding

Part 4: 3D vs. Traditional Scaling

Part 5: Heat Generation Issues with Chip Stacking and Thermal Dissipation Requirements

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