BrightSpots Display Forum

BrightSpots LED Forum

BrightSpots Lithography Forum

MCA BrightSpots 450-mm Forum

My Content

My Sites

Part 5: Heat Generation Issues with Chip Stacking and Thermal Dissipation Requirements

Problems with audio/videos?
youtube.com

10 of 10

Submitted by:

Karen Do on July 20, 2009 - 10:00am

# of Views: 839

All Audio/Videos

BrightSpots Sit Down with Jean-Christophe Eloy, Yole Developpement

By Karen Do on Jul 28, 2009

BrightSpots Sit Down with Robert Patti, Tezzaron Semiconductor

By Karen Do on Jul 28, 2009

BrightSpots Sit Down with Ricardo Borges, Synopsys

By Karen Do on Jul 28, 2009

BrightSpots Sit Down with Sitaram Arkalgud, SEMATECH

By Karen Do on Jul 28, 2009

BrightSpots Sit Down with Paul Lindner, EV Group

By Karen Do on Jul 28, 2009

Part 1: Defining 3D at the Packaging Level and the Circuit Level

By Karen Do on Jul 20, 2009

Part 2: Wire Bonding vs. TSVs and Design Tools for 3D

By Karen Do on Jul 20, 2009

Part 3: Thin-wafer Handling Temporary Bonding/Debonding

By Karen Do on Jul 20, 2009

Part 4: 3D vs. Traditional Scaling

By Karen Do on Jul 20, 2009

Part 5: Heat Generation Issues with Chip Stacking and Thermal Dissipation Requirements

By Karen Do on Jul 20, 2009