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Suppliers Discuss 3D IC Readiness at SEMICON West

http://www.youtube.com/watch?v=hYdXTixVl9A

8 of 23

Manish Ranjan, Ultratech; Thorsten Matthias, EV Group; Mark Berry, Metryx; Robert Newcomb, Qcept Technologies; Akira Morita, Norsdon ASYMTEK; and Jim Quinn, Multitest; speak to 3D InCites about HVM tool readiness, metrology solutions, material dispense needs, and test equipment for 3D IC commercialization.

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Francoise Von Trapp on July 23, 2012 - 3:12pm

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