The International Conference on Planarization/CMP Technology ICPT 2012 will be held at the Minatec conference center in Grenoble, France, in close n Read More>> | 358 | 45 weeks |
Yehiel Gotkis- a world class technologist and material scientist
provides consulting services on variety of subjects associuated with
IC and MEM Read More>> | 1801 | 2 years |
Techcet
Forecasts Revenue Recovery Delayed to 2012
Read More>> | 1660 | 2 years |
Karey Holland & I presented CMP talks at Semicon West as part of the CMP Users Group. These will be posted soon on the NCCAVS CMPUG site, and th Read More>> | 1769 | 2 years |
| 1852 | 3 years |
The CMP Technology Assessment Roundtable is coming to a close this Monday, the 18th, at 6pm PST. We've had a great participation in this year's Rou Read More>> | 1145 | 3 years |
I'd appreciate any inputs and comments regarding bubble generation (and hopefully supression of bubbles) during CMP.
As you know metal polish Read More>> | 1325 | 3 years |
Other than the oxide particles used in convectional slurries (silica, ceria, alumina) and pad debris, what new nano-size particles could be present (n Read More>> | 1623 | 3 years |
The first week of the CMP Technology Assessment Roundtable 1Q10 is coming to an end. It's been an exciting one. So far, we've had over 50 replies Read More>> | 927 | 3 years |
What are the limits of current CMP computer models?
What real-world performance can we predict under which conditions?
Read More>> | 1490 | 3 years |
Can improved slurry waste-stream monitoring and the
use of flocculants pay for itself in reduced disposal costs?
Read More>> | 1852 | 3 years |
Are there there any new data on the root causes of CMP
defects? Are there quantitative data on silica type (e.g., precipitated, vs.
sol-gel vs. Stöb Read More>> | 1613 | 3 years |
In slurry management and cost-reduction, can the
number of turns be extended into the hundreds with novel additives, doping, and
scavaging?
Read More>> | 1910 | 3 years |
Applied Materials has released a new
two-head-per-platten/two-platten tool for Cu damascene flows in memory fabs;
will logic lines try it for Cu int Read More>> | 2058 | 3 years |
Stöber-process silicas (a.k.a. "sol") produced from
TEOS or TMOS have been tested for the final barrier/cap removal CMP step in
Read More>> | 1827 | 3 years |
Are direct materials consumed in CMP over-specified
such that cost-reductions may be expected, or do tight process windows (i.e.
Read More>> | 1535 | 3 years |
Post-CMP cleaning solutions for copper use either low-
or high-pH. Which one is preferable for specific applications and why?
Read More>> | 3743 | 3 years |
Continued variability in the performance of diamond
conditioners shows that the suppliers lack an effective quality control (QC)
Read More>> | 1925 | 3 years |
Recent studies show that pad debris generated during
conditioning may result in significant CMP defects. How dominant is this effect,
Read More>> | 3719 | 3 years |
Future Cu CMP over ultra-low-k dielectrics (ULK) may
require almost zero downforce; will we finally have to use electro-CMP (ECMP)
or can Read More>> | 2775 | 3 years |
