Paul, what are the biggest impacts you see from not having a new technology ready to supplement or replace 193 nm immersion?
(Anybody else, feel free Read More>> | 792 | 2 years |
How far can designers adapt to design rule restrictions? Read More>> | 878 | 2 years |
Manufacturing issues are often uncovered only after a new lithography solution enters full production. Franklin, as our resident mask expert, perhaps Read More>> | 851 | 2 years |
EUV mask defectivity is such a major issue facing the industry today. Is this something that can be resolved in a timely enough manner? Read More>> | 974 | 2 years |
Aki, can you explain more about Model-Based Mask Data Preparation (MB-MDP) and how it differs from conventional fracturing?
Also, I know it's an e-be Read More>> | 956 | 2 years |
This question came in from a webcast viewer: Have some logic chips already stopped scaling at 90 or 65 nm? Beyond microprocessors, will all logic keep Read More>> | 630 | 2 years |
If you didn't attend the live panel event at BACUS earlier this week, then you missed out on the eBeamer, served in shot glasses given out to attendee Read More>> | 707 | 2 years |
This may be a touchy subject, particularly for the suppliers (and admittedly somewhat unrealistic), but I’m interested in hearing the answer anyway. I Read More>> | 914 | 2 years |
Wilhelm, welcome to the group. I’m very interested in getting your logic perspective in any of these discussions, but I wanted to ask you overall as w Read More>> | 914 | 2 years |
Mike, you mentioned the other day about some of the Moore’s Law drivers perhaps dissipating — clock speed slowing and cost per transistor scaling less Read More>> | 805 | 2 years |
We talked a fair bit during the live panel about whether there really needs to be a “battle” between EUV and direct-write e-beam, for example, or whet Read More>> | 774 | 2 years |
As our time ran out and we unfortunately had to wrap up the live panel discussion Tuesday night, we had a lively debate in full swing regarding the fu Read More>> | 802 | 2 years |
The Lithography Workshop started in 1981 to try to break the “one-micron optical barrier,” so a limit has always been seen on the horizon. However, th Read More>> | 1755 | 3 years |
While both 3D stacking and 2D shrinking provide benefits, both require investment to develop. In particular, if a single EUV lithography exposure tool Read More>> | 1702 | 3 years |
Is 3D merely the solution to 2D problems, or is 3D a new direction independent of 2D? Hypothetically, if EUV lithography somehow was ready today with Read More>> | 1423 | 3 years |
