I just finished putting together a presentation for the upcoming BiTS Workshop March 7-10, 2010 taking place in my backyard in Mesa, AZ. Read More>> | 741 | 3 years |
The following commentary piece by Electronic Design Europe's editor-in-chief, Paul Whytock, gives designers some insight on some recent developments Read More>> | 680 | 3 years |
Will this be the year for 3D IC design tools? Who knows for sure? But by the looks of the agendas of some upcoming design-centric events, 3D certainly Read More>> | 1310 | 3 years |
Anne-Francoise Pele of EE Times reports on a €50M R&D initiative launched by NXP spinoff, Ipdia, involving investment from nine European partner Read More>> | 713 | 3 years |
Contributing editor Françoise von Trapp writes about 3D technology and
packaging in Electronic Design's 2010 Forecast issue and highlights
some of Read More>> | 682 | 3 years |
This year, both my daughters joined the high school debate team. Team parents are asked to judge tournaments from time to time, so a few weeks ago, I Read More>> | 1406 | 3 years |
This is way too big a deal to just post a press release about. When I read the news on the SEMI website, I decided a public kudos was much more approp Read More>> | 2160 | 3 years |
As the whole world attempts to climb out of the economic hole it finds itself in, I’m curious about the different approaches being taken across the gl Read More>> | 1217 | 3 years |
Well, 2010 is here and we want to wish all our readers a happy and prosperous New Year! Read More>> | 910 | 3 years |
It’s hard to believe I’ve been at this for a almost a year. Read More>> | 1103 | 3 years |
Ever since my Advanced Packaging days, I’ve been drawn to follow what’s going on with the start-up companies. Their news is exciting. Read More>> | 2310 | 3 years |
The following post by IEEE Spectrum's associate editor, Sally Addee,covers last week's IEDM Conference in Baltimore, MD, where 3D integration gained Read More>> | 979 | 3 years |
Friday was the OSATs turn to offer their status reports with regard to market readiness for 3D TSV production. Read More>> | 1652 | 3 years |
They brought in a few of the big guns today (Intel, IBM, TSMC) to offer perspectives and updates on the commercialization of 3D integration. As with m Read More>> | 1208 | 3 years |
It’s always a challenge to adequately sum up several hours of detailed discussion on a topic, and this afternoon’s symposium was no different. Read More>> | 1387 | 3 years |
