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SEMICON West 2010 3D Wrap-up Forum

It's not over yet! There was alot of information to absorb in the 3D IC and 3D Packaging space at SEMICON West 2010. Please join in this wrap up discussion with industry experts from SEMATECH, SUSS MicroTec, EV Group, S.E.T. and more. The discussions will open Monday, July 19 and continue through Friday, July 23, 2010.

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3D Co-Design Challenges (concluded) By Francoise von Trapp on Jul. 16, 2010 - 4 replies		2308	08/02/2010 9:29am

Stress Management for 3D ICs using TSVs (concluded) By Francoise von Trapp on Jul. 16, 2010 - 2 replies		1295	08/02/2010 9:30am

Metrology Considerations for 3D IC interconnect (concluded) By Francoise von Trapp on Jul. 16, 2010 - 13 replies		2148	08/02/2010 10:00am

The Need for 3D Standards (concluded) By Francoise von Trapp on Jul. 16, 2010 - 8 replies		1847	08/02/2010 10:19am

Tweaking the TSV Processes and Process Flow (concluded) By Francoise von Trapp on Jul. 16, 2010 - 17 replies		2515	08/02/2010 11:22am

Progress in 3D Test Solutions (concluded) By Francoise von Trapp on Jul. 19, 2010 - 4 replies		1544	08/02/2010 10:21am

What's going on in the NON-TSV 3D world? (concluded) By Francoise von Trapp on Jul. 16, 2010 - 2 replies		1765	08/02/2010 10:22am

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