Alchimer's Technology Discussion
Up until recently, the only available methodologies for performing necessary metallization steps for fabricating through-silicon vias (TSVs) relied on conventional dry processes like physical vapor deposition (PVD), chemical vapor deposition (CVD) and atomic layer deposition (ALD). These processes each have weaknesses such as low throughput and high cost. In July 2009, Alchimer S.A. introduced a family of wet deposition processes for isolation, barrier, and copper seed layers for TSV metallization, which addresses such weaknesses, and is a cost-reduced alternative to conventional dry methods. From Sept. 21 – 25, Join us on 3D InCites for an online discussion with Alchimer’s executive team: Steve Lerner, CEO; Kathy Cook, Director of Business Development; and Claudio Truzzi, CTO. Following a brief summary of Alchimer’s technology itself, the discussion will focus on exposing these weaknesses and how Alchimer’s processes address them.
