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3D IC Supply Chain Issues

Establishing a supply chain infrastructure to accommodate 3D integration using TSVs has been identified as one of the most immediate issues needing to be addressed. This forum will discuss the industry options, and what's being done about it.

Moderator: Robert Petrossian,Francoise von Trapp

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Who will handle post-fab processes? By Francoise von Trapp on Jul. 09, 2009 - 3 replies		2155	07/26/2009 7:17pm

What business aspects need to be considered for volume production? By Francoise von Trapp on Jul. 06, 2009 - 5 replies		973	07/26/2009 7:29pm

Has TSV changed the supply chain value proposition? By Francoise von Trapp on Jul. 07, 2009 - 3 replies		926	07/17/2009 2:48pm

What is delaying 3D IC technology in high-volume manufacturing? By Francoise von Trapp on Jul. 09, 2009 - 7 replies		2076	07/26/2009 7:49pm

How can synergies be exploited to drive down costs? By Francoise von Trapp on Jul. 20, 2009 - 0 reply		1615	No replies yet

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